publication number s71ws-p_00 revision a amendment 2 issue date august 21, 2006 s71ws-p based mcp products s71ws-p based mcp products cover sheet 1.8 volt-only x16 simultaneous read/write, burst mode flash memory with cellularram data sheet (advance information) notice to readers: this document states the current technical specifications regarding the spansion product(s) described herein. each product described herein may be designated as advance information, preliminary, or full production. see notice on data sheet designations for definitions.
ii s71ws-p based mcp products s71ws-p_00_a2 august 21, 2006 data sheet (advance information) notice on data sheet designations spansion inc. issues data sheets with advance information or preliminary designations to advise readers of product information or intended specifications throughout the product life cycle, including development, qualification, initial production, and full production. in all cases, however, readers are encouraged to verify that they have the latest information before finalizing their design. the following descriptions of spansion data sheet designations are presented here to highlight their presence and definitions. advance information the advance information designation indicates that spansion inc. is developing one or more specific products, but has not committed any design to production. information presented in a document with this designation is likely to change, and in some cases, development on the product may discontinue. spansion inc. therefore places the following conditions upon advance information content: ?this document contains information on one or more products under development at spansion inc. the information is intended to help you evaluate this product. do not design in this product without contacting the factory. spansion inc. reserves the right to change or discontinue work on this proposed product without notice.? preliminary the preliminary designation indicates that the product development has progressed such that a commitment to production has taken place. this designation covers several aspects of the product life cycle, including product qualification, initial production, and the subsequent phases in the manufacturing process that occur before full production is achieved. changes to the technical specifications presented in a preliminary document should be expected while keeping these aspects of production under consideration. spansion places the following conditions upon preliminary content: ?this document states the current technical specifications regarding the spansion product(s) described herein. the preliminary status of this document indicates that product qualification has been completed, and that initial production has begun. due to the phases of the manufacturing process that require maintaining efficiency and quality, this document may be revised by subsequent versions or modifications due to changes in technical specifications.? combination some data sheets contain a combination of products with different designations (advance information, preliminary, or full production). this type of document distinguishes these products and their designations wherever necessary, typically on the first page, the ordering information page, and pages with the dc characteristics table and the ac erase and program table (in the table notes). the disclaimer on the first page refers the reader to the notice on this page. full production (no designation on document) when a product has been in production for a period of time such that no changes or only nominal changes are expected, the preliminary designation is removed from the data sheet. nominal changes may include those affecting the number of ordering part numbers available, such as the addition or deletion of a speed option, temperature range, package type, or v io range. changes may also include those needed to clarify a description or to correct a typographical error or incorrect specification. spansion inc. applies the following conditions to documents in this category: ?this document states the current technical specifications regarding the spansion product(s) described herein. spansion inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. however, typographical or specification corrections, or modifications to the valid combinations offered may occur.? questions regarding these document designations may be directed to your local amd or fujitsu sales office.
this document contains information on one or more products under development at spans ion llc. the information is intended to he lp you evaluate this product. do not design in this product without contacting the fact ory. spansion llc reserves the right to change or discontinue work on this proposed product without notice. publication number s71ws-p_00 revision a amendment 2 issue date august 21, 2006 features ? power supply voltage of 1.7 to 1.95v ? flash access time: 80 ns, 25 ns ? flash burst frequencies: 66 mhz, 80 mhz, 108 mhz ? psram access time: 70 ns, 20 ns ? psram burst frequency: 66 mhz, 80 mhz, 104 mhz ? package: ? 8.0 x 11.6 mm mcp ? operating temperature ? ?25c to +85c (wireless) the s71ws series is a product line of stacked packages and consists of: ? one or two s29ws-p nor flash memory die ? cellularram die the products covered by this document are listed in the table below. note: for a full list of opns, please contact the local sales representative or refer to the ordering information valid combinations tables. for detailed specifications, please refer to the individual data sheets. s71ws-p based mcp products 1.8 volt-only x16 simultaneous read/write, burst mode flash memory with cellularram data sheet (advance information) device cellularram density (mb) 64 mb 128 mb s29ws512p s71ws512pc0 s71ws512pd0 document publication identification number (pid) s29ws-p s29ws-p_00 128 m cellularram type 2 cellram_04 64 m cellularram type 2 cellram_07
2 s71ws-p based mcp products s71ws-p_00_a2 august 21, 2006 data sheet (advance information) 1. product selector guide 2. mcp block diagram device model number flash density (mb) cellularram density (mb) flash speed (mhz) cellularram speed (mhz) cellularram supplier package s71ws512pd0hf3 hr 512 128 80 104 ty p e 2 mcp 8 x 11.6 mm s71ws512pc0hf3 sv 64 66 s71ws512pd0hf3 hl 128 108 104 a0-amax a0-amax aflash aflash rdy rdy dq0-dq15 clk clk avd# avd# f-ce# ce# oe# oe# f-rst# reset# vss vss f-acc acc f-wp# wp# f-we# we# vcc f-vcc vccq f-vccq a0-amax wait# clk avd# r-ce# ce# oe# r-lb# lb# r-ub# ub# we# r-cre cre vss vcc r-vcc vccq r-vccq dq0-dq15 dq0-dq15 ws-p flash memory psram memory
s71ws-p_00_a2 august 21, 2006 s71ws-p based mcp products 3 data sheet (advance information) 3. connection diagrams 3.1 special handling instructions for fbga package special handling is required for flash memory products in fbga packages. flash memory devices in fbga packages may be damaged if exposed to ultrasonic cleaning methods. the package and/or data integrity may be compromised if the package body is exposed to temperatures above 150c for prolonged periods of time. 3.2 look-ahead ballout for future designs please refer to the design-in scalable wireless solutions with spansion products application note (publication number: design_scalable_wireless_a0_e). contact your local spansion sales representative for more details. mcp flash-only addresses shared addresses s71ws512pd0 a24-a23 a22-a0 s71ws512pc0 a24-a22 a21-a0 3 2910 5 47 68 1 dnu dnu b d e f g h j k l m a c vss avd# rfu rfu clk rfu f-vcc rfu a7 f-wp# rfu f-acc r-lb# a8 we# a11 a6 a3 a15 f-rst# r-ub# a19 rfu a12 a5 a2 a21 rdy a18 a9 a20 a13 a4 a1 a22 rfu a17 a10 a23 a14 vss a0 a16 rfu dq1 dq6 rfu a24 oe# f-ce# r-cre dq3 dq9 dq13 dq4 dq15 dq0 r-ce# vss f-vcc dq10 dq12 r-vcc dq7 dq8 rfu rfu dq11 dq2 dq5 rfu dq14 rfu rfu dnu f-vcc vss rfu rfu f-vccq dnu dnu legend flash & psram shared only do not use nor flash only reserved for future use psram only
4 s71ws-p based mcp products s71ws-p_00_a2 august 21, 2006 data sheet (advance information) 3.3 nor flash and psram in put/output descriptions amax-a0 = nor flash address inputs dq15-dq0 = flash data input/output, shared between nor and ornand flash. dq0-dq7 shared for x8 ornand f-ce# = nor flash chip-enable input #1. asynchronous relative to clk for burst mode. oe# = output enable input. asynchrono us relative to clk for burst mode. we# = write enable input. f-v cc = nor flash device power supply (1.7 v - 1.95v). f-v ccq = input/output buffer power supply. v ss =ground rfu = reserved for future use rdy = flash ready output. indicates the status of the burst read. vol = data valid. the flash rdy pin is shared with the wait pin of the psram. clk = nor flash clock, shared with clk of burst-mode psram.. the first rising edge of clk in conjunction with avd# low latches the address input and activates burst mode operation. after the initial word is output, subsequent rising edges of clk increment the internal address counter. clk should remain low during asynchronous access. avd# = nor flash address valid input. shared with avd# of burst-mode psram. indicates to device that the valid address is present on the address inputs. vil = for asynchronous mode, indicates valid address; for burst mode, causes starting address to be latched on rising edge of clk. vih= device ignores address inputs f-rst# = nor flash hardware reset input. vil= device resets and returns to reading array data f-wp# = nor flash hardware write protect input. vil = disables program and erase functions in the four outermost sectors. f-acc = nor flash accelerated input. at vhh, accelerates programming; automatically places device in unlock bypass mode. at vil, disables all program and erase functions. should be at vih for all other conditions. r-ce# = chip-enable input for psram r-cre = control register enable (psram). for cellularram only. r-vcc = psram power supply r-ub# = upper byte control (psram) r-lb# = lower byte control (psram) dnu = do not use
s71ws-p_00_a2 august 21, 2006 s71ws-p based mcp products 5 data sheet (advance information) 4. ordering information the order number is formed by a valid combinations of the following: s71ws 512 p d0 hf 3 h r 0 packing type 0 = tray 2 = 7? tape and reel 3 = 13? tape and reel model number 2 r = 80 mhz flash speed v = 66 mhz flash speed l = 108 mhz flash speed model number 1 h = cellularram type 2, dyb=1, ppb = 0 s = cellularram type 2, dyb=1, ppb=1 package descriptor depends on character 12. for a more detailed description see table 4.1 . package type & material set hf = 1.2mm mcp fbga, pb-free kf = 1.2mm pop fbga, pb-free jf = 1.4mm mcp fbga, pb-free cellularram density d0 = 128 mb c0 = 64 mb process technology p = 90 nm, mirrorbit tm technology code flash density 256 = 256 mb 512 = 512 mb product family s71ws stacked products (mcp/pop) 1.8 v nor flash with psram table 4.1 character position descriptions (sheet 1 of 2) character 12 character 14 character 14 description package area package ball count raw ball size h, j, or g 07x9mm56 0.35 mm 17x9 mm80 2 8x11.6 mm 64 3 8x11.6 mm 84 4 9x12 mm 84 5 9x12 mm 115 6 9x12 mm 137 7 11x13 mm 84 8 11x13 mm 115 9 11x13 mm 137
6 s71ws-p based mcp products s71ws-p_00_a2 august 21, 2006 data sheet (advance information) 4.1 valid combinations valid combinations list configurations planned to be supported in volume for this device. consult your local sales office to confirm availability of specific valid combinations and to check on newly released combinations. notes: 1. packing type 0 is standard. specify other options as required. 2. bga package marking omits leading s and packing type designator from ordering part number. k a 11x11 mm 112 0.45 mm b 11x11 mm 112 0.50 mm d 12x12 mm 128 0.45 mm f 12x12 mm 128 0.50 mm g 14x14 mm 152 0.45 mm h 14x14 mm 152 0.50 mm j 15x15 mm 160 0.45 mm k 15x15 mm 160 0.50 mm l 17x17 mm 192 0.45 mm m 17x17 mm 192 0.50 mm table 4.1 character position descriptions (sheet 2 of 2) character 12 character 14 character 14 description package area package ball count raw ball size s71ws-p valid combinations nor flash speed (mhz) cellularram speed (mhz) cellularram supplier package type package markings device package & material set package descriptor model number packing type s71ws512pd0 hf 3 hl 0, 2, 3 (note 1) 108 104 type 2 8 x 11.6 mm (note 2) hr 80 s71ws512pc0 sv 66
s71ws-p_00_a2 august 21, 2006 s71ws-p based mcp products 7 data sheet (advance information) 5. physical dimensions 5.1 tla084? 84-ball fine pitch ball grid array (fbga) 8x11.6mm package 3372-2 \ 16-038.22a package tla 084 jedec n/a d x e 11.60 mm x 8.00 mm package symbol min nom max note a --- --- 1.20 profile a1 0.17 --- --- ball height a2 0.81 --- 0.97 body thickness d 11.60 bsc. body size e 8.00 bsc. body size d1 8.80 bsc. matrix footprint e1 7.20 bsc. matrix footprint md 12 matrix size d direction me 10 matrix size e direction n 84 ball count ? b 0.35 0.40 0.45 ball diameter ee 0.80 bsc. ball pitch ed 0.80 bsc ball pitch sd / se 0.40 bsc. solder ball placement a2,a3,a4,a5,a6,a7,a8,a9 depopulated solder balls b1,b10,c1,c10,d1,d10, e1,e10,f1,f10,g1,g10, h1,h10,j1,j10,k1,k10,l1,l10, m2,m3,m4,m5,m6,m7,m8,m9 notes: 1. dimensioning and tolerancing methods per asme y14.5m-1994. 2. all dimensions are in millimeters. 3. ball position designation per jesd 95-1, spp-010. 4. e represents the solder ball grid pitch. 5. symbol "md" is the ball matrix size in the "d" direction. symbol "me" is the ball matrix size in the "e" direction. n is the number of populted solder ball positions for matrix size md x me. 6 dimension "b" is measured at the maximum ball diameter in a plane parallel to datum c. 7 sd and se are measured with respect to datums a and b and define the position of the center solder ball in the outer row. when there is an odd number of solder balls in the outer row sd or se = 0.000. when there is an even number of solder balls in the outer row, sd or se = e/2 8. "+" indicates the theoretical center of depopulated balls. 9. n/a 10 a1 corner to be identified by chamfer, laser or ink mark, metallized mark indentation or other means. c 0.08 0.20 c a e b c 0.15 (2x) c d c 0.15 (2x) index mark 10 6 b top view side view corner 84x a1 a2 a 0.15 c a b m c m 0.08 pin a1 ml e1 7 se a d1 ed dc e f g h j k 10 8 9 7 6 4 3 2 1 ee 5 b pin a1 corner 7 sd bottom view
8 s71ws-p based mcp products s71ws-p_00_a2 august 21, 2006 data sheet (advance information) 6. revision history 6.1 revision a (february 21, 2006) initial release. 6.2 revision a1 (april 12, 2006) added the s71ws512pc0 6.3 revision a2 (august 21, 2006) added the s71ws512pd0 108mhz opn colophon the products described in this document are designed, developed and manufactured as contemplated for general use, including wit hout limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and m anufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a s erious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in we apon system), or (2) for any use where chance of failure is intolera ble (i.e., submersible repeater and artifi cial satellite). please note that spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. any semic onductor devices have an inherent chance of failure. you must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection , and prevention of over-c urrent levels and other abnormal operating conditions. if any products described in this document represent goods or technologies subject to certain restriction s on export under the foreign exchange and foreign trade law of japan, the us export administration regulations or the applicable laws of any oth er country, the prior authorization by the respective government entity will be required for export of those products. trademarks and notice the contents of this document are subject to change without notice. this document may contain information on a spansion product under development by spansion. spansion reserves the right to change or discontinue work on any product without notice. the informati on in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, no n-infringement of th ird-party rights, or any other warranty, exp ress, implied, or statutory. spansion assume s no liability for any damages of any kind arising out of the use of the information in this document. copyright ? 2006 spansion inc. all rights reserved. spansion, the spansion logo, mirrorbit, ornand, hd-sim, and combinations th ereof are trademarks of spansion inc. other names are for informational purposes only and may be trademarks of their respective owners.
|
